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CIN::APSE ?
High-Speed Interconnect Technology
THE BUTTON CONTACT
The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
?
?
?
Small form factor (0.020" diameter by 0.32" min. high)
Low compression force (approx. 2.5 oz. min. per contact)
Multiple beam structures
?
?
?
Several points of contact per button
Extremely lightweight
Natural wiping action
T ypical CIN::APSE Applications
? LGA package I/O to PC board (IC packages,
Electrical
? Short signal path
? Very low inductance and resistance
? Signal integrity tested in the GHz range
CIN::APSE APPLIED
The basic button contact
multi-chip modules)
? PC board to PC board (parallel processors,
enhancement/mezzanine cards)
? Flex circuit to PC board (rigid flex, harnessing)
? Flex circuit to ceramic (chip to harness)
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
Step 1 :
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Step 2:
Add Z-Axis compression
and secure.
Call Toll Free: 1 (800) 323-9612
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